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Wafer, IC Chip and Board
​thermal warpage and CTE measurement systems

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Picture
Stand alone system for both   warpage and CTE measurement
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Picture

 ​ DIC (Digital Image Correlation) based high temperature system for thermal warpage, deformation, strain and CTE (Coefficient of Thermal Expansion) measurement
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​APEX Research and Analysis
   Designed in USA; Assembled in Taiwan
​

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