---

---

 Thermal strains  of various components on IC board     ​

Strain map of bending of an IC memory board 

---

_________________________________________________________________________________________________

---

Drop impact test at board or product level

When combined with high speed cameras, DIC can reveal whole-field strain , displacement and vibration mode  characterization of electronic PCB board or product (e.g. phone) during drop impact test for reliability.

Unlike in traditional strain gage method in which the strain at a single  point is  obtained, DIC  method  can  acquire the  information on the surface of the   entire test specimen.

___________________________________________________________________________________

Relevant Links:
1. DIC technology:  www.correlatedsolutions.com
2.  JEDEX 
3.   Drop test:   Yu, et al. 2010 "microelectronics Reliability",   1028-1038
​4.   Alpha Precision Instrumentation Corp. , Taipei, Taiwan (www.apic.com.tw)

​

​APEX Research and Analysis